Rama Shukla
Vice President, Mobility Group and Director of Platform Program Office, Intel Corporation
Rama Shukla is Vice President of the Mobility Group and Director of the WiMax Program Office at Intel Corporation. He is responsible for planning and deployment of the firm's WiMAX business initiative. Shukla joined Intel in 1979. Prior to his current assignment, he held a number of technical and business management positions spanning development of silicon technologies and mobile products, including engineering manager, Centrino platform program management, general manager of the silicon-based photonics optical components business group and other key roles. Shukla holds several patents and has published numerous papers related to silicon device processing and assembly technologies. He received the IEEE Manufacturing Technology of the Year Award in 2000 for leading the transition to flip-chip laminated package and interconnects technologies at Intel. Shukla received a master's degree in solid state chemistry from the Indian Institute of Technology and a Ph.D. in materials science and engineering from the University of California, Berkeley.
Global Conference 2013
Former Prime Minister Tony Blair, philanthropist Bill Gates and Strive Masiyiwa of Econet Wireless discuss advancing prosperity in Africa.
